Assignment#5

"DVD Recording"

Alright, I know that many of you may say that there are plenty of DVD burning progs out there and that if I do a guide like this I should cover all of them. But I only got Nero and many users are asking me about how to burn a DVD-Video with Nero, so that's why Nero is the one for the guide.This guide is supposed to be used by people that have created the compressed DVD files using DVD Shrink and now they don't know what to do with them or everyone that wants to see how to create a DVD-Video. Remember that for the DVD Decrypter guide you don't need Nero, as DVD Decrypter can burn the ISO file itself. Anyway before start reading this guide keep in mind that it is for use with DVD Shrink or other program that creates .IFO and .VOB files. Don't use it to burn files or mp3 in your DVD, for this you need to select a DVD-ISO disc.Of course, Nero Burning ROM is a commercial program and we don't have it available for download. Instead you can get a trial version here.

*First of all I make clear that I use version 6. If you have an older version that supports DVD (I think all the versions after 5.5.x.x) then the process is the same. Please make sure you start Nero Buring ROM I show here and NOT the Nero SmartStart
*The new complication comes up. If you see a Wizard close it (there must be a button down right which says Close Wizard or something). Open the pull-down menu I show and select DVD.
NOTE: If there is no pull-down menu then your version does not support DVD
*Select DVD-Video (1) from the list. Then just make sure the settings (2) are the same as shown here. Then click on the Label tab.
*Here just put the label that you want your DVD to have. (It's the name that you see before your drive's letter every time you go to My Computer). After that click New.
*

Package type

FC-PGA Package Type


















FC-PGA Package TypeThe FC-PGA package is short for flip chip pin grid array, which have pins that are inserted into a socket. These chips are turned upside down so that the die or the part of the processor that makes up the computer chip is exposed on the top of the processor. By having the die exposed allows the thermal solution can be applied directly to the die, which allows for more efficient cooling of the chip. To enhance the performance of the package by decoupling the power and ground signals, FC-PGA processors have discrete capacitors and resistors on the bottom of the processor, in the capacitor placement area (center of processor). The pins on the bottom of the chip are staggered. In addition, the pins are arranged in a way that the processor can only be inserted one way into the socket. The FC-PGA package is used in Pentium® III and Intel® Celeron® processors, which use 370 pins.





FC-LGA4 Package Type





















FC-LGA4 Package TypeThe FC-LGA4 package is used with Pentium® 4 processors designed for the LGA775 socket. FC-LGA4 is short for Flip Chip Land Grid Array 4. FC (Flip Chip) means that the processor die is on top of the substrate on the opposite side from the LAND contacts. LGA (LAND Grid Array) refers to how the processor die is attached to the substrate. The number 4 stands for the revision number of the package.This package consists of a processor core mounted on a substrate land-carrier. An integrated Heat Spreader (IHS) is attached to the package substrate and core and serves as the mating surface for the processor component thermal solution such as a heatsink.You may also see references to processors in the 775-LAND package. This refers to the number of contacts that the new package contains that interface with the LGA775 socket.The pictures below include the LAND Slide Cover (LSC). This black cover protects the processor contacts from damage and contamination and should be retained and placed on the processor whenever it is removed from the LGA775 socket.



FC-PGA2 Package Type

FC-PGA2 Package TypeFC-PGA2 packages are similar to the FC-PGA package type, except these processors also have an Integrated Heat Sink (IHS). The integrated heat sink is attached directly to the die of the processor during manufacturing. Since the IHS makes a good thermal contact with the die and it offers a larger surface area for better heat dissipation, it can significantly increase thermal conductivity. The FC-PGA2 package is used in Pentium III and Intel Celeron processor (370 pins) and the

Pentium 4 processor (478 pins)

.

Motherboard form factor

Motherboard Form Factors

The form factor determines the general layout, size, and feature placement on a motherboard. Different form factors usually require different style cases. Differences between form factors can include; physical size and shape, mounting hole location, feature placement, power supply connectors, and others.

ATX

ATX was developed as an evolution of the Baby AT form factor and was defined to address four areas of improvement: enhanced ease of use, better support for current and future I/O, better support for current and future processor technology, and reduced total system cost.

The ATX is basically a Baby AT rotated 90 degrees and providing a new mounting configuration for the power supply. The processor is relocated away from the expansion slots, allowing them to hold full length add-in cards. The longer side of the board is used to host more on-board I/O. The ATX power supply, rather than blowing air out of the chassis, as in most Baby AT platforms, provides air-flow through the chassis and across the processor.

Mini-ATX

This form factor is basically the same as ATX with a smaller allowable board size.

• ATX = 12" x 9.6"
• Mini-ATX = 11.2" x 8.2"

microATX

This form factor was developed as a natural evolution of the ATX form factor to address new market trends and PC technologies. microATX supports:

• Current processor technologies
• The transition to newer processor technologies
• AGP high performance graphics solutions
• Smaller motherboard size
• Smaller power supply form factor

FlexATX

A subset of the microATX design. FlexATX offers the opportunity for system developers to create many new personal computer designs. FlexATX allows enhanced flexibility where conforming motherboards may be enclosed; that is, all-in-one computing devices, LCD-personal computers, or standard desktop systems.

This form factor is designed to allow very custom case and board designs to be manufactured. For example; The NBA could commission computers that looked like basketballs. There is not too much limit on the shape of the board and case. We should see some very interesting system designs emerging from this form factor.

• Supports current socketed processor technologies
• Smaller motherboard size
• ATX 2.03 I/O panel
• Same mounting holes as microATX
• Socket only processors to keep the size small

LPX & Mini LPX

This is based on a design by Western Digital. The expansion slots are on a single riser card which is mounted onto the planar board. Mainly OEM manufacturers (i.e. Packard Bell/NEC, Dell, etc) use these boards.

LPX is an older form factor (8.67" x 9.25") that has been replaced by NLX. The LPX form factor is usually found in desktop model PCs. The LPX case is a slim-line, low-profile case with a riser card arrangement for expansion cards. This means that expansion boards are parallel to the motherboard, rather than perpendicular to it as in other common form factors, such as AT and ATX. This allows for smaller cases, but limits the number of expansion slots, usually to two or three.

LPX motherboards often have the video adapters integrated onto the motherboard, and they may have integrated sound as well. This can provide a high-quality product at low cost, but can make upgrading or repair difficult. It is not always possible to disable the built-in video adapter cards to allow for an upgrade. LPX motherboards also usually come with serial, parallel, and mouse connectors attached to them, like ATX.

The LPX case and motherboard design are not designed for a home PC builder, as they can be cramped and difficult to work in, as well as being non-standard. They also offer poor expandability, poor upgradability, poor cooling, and difficulty of use for the home PC builder.

NLX

NLX is a new low profile motherboard form factor designed to improve upon today’s low profile form factors and to adapt to new market trends and PC technologies. NLX does the following:

• Supports current and future processor technologies
• Supports new Accelerated Graphics Port (A.G.P.) high performance graphics solutions
• Supports tall memory technology
• Provides more system level design and integration flexibility; for example, the new design flexibility allows system designers to implement a motherboard that can be removed quickly, in most cases without removing screws, thus lowering the PC’s total cost of ownership.

The picture above shows an example of an NLX board and riser.

• The add-in card riser is located at the right edge of the motherboard (as viewed from the front).
• The processor is located at the front, left section of the motherboard, improving thermal and clearance issues.
• Taller components such as the processor and tall memory are preferred to be located on the left side of the motherboard, allowing the I/O slots to hold full length add-in cards in many system configurations.
• At the back of the motherboard (as viewed from the front), the I/O connectors are stacked single and double high to support more connectors.

Several major PC vendors world-wide worked jointly to define the NLX form factor and to incorporate flexibility to accommodate the best designs for current and future PCs. NLX is a public specification intended for widespread use in many types of systems.